Principle and Realization of IC Wafer Transfer with High Efficient and Stabilization
Haijun Han,Yanjie Liu,Weibing Rong,Lining Sun
DOI: https://doi.org/10.3969/j.issn.1009-2412.2013.04.004
2013-01-01
Abstract:In the manufacturing process of very-large-scale in-tegrated circuit ( VLSI ) , wafers are required to be transferred among hundreds of technological processes , therefore, the performance of wafer transfer is crucial to the development of the entire IC industry .As one of the essential equipment for IC manufacturing , the wafer transfer robot undertakes the important task of wafer po-sitioning and fast and steadily transferring . With IC manufacturing developing toward the large-size ( diame-ter ≥300mm) wafer and small feature size (line-width≤32nm) direction, the wafer production line becomes more compact, with higher processing speed in more cleaner environment , which requires the higher per-formance of wafer transfer robot .In order to realize effi-ciently and steadily wafer transfer with high-efficiency and stabilization , we have conducted three aspects of research, that is, the accurate and stable trajectory tracking control of wafer transfer robot , the development of micro-fiber array for wafer transfer and the develop-ment of tactile sensor for force measurement and stick-slip detection .According to the problem with movable joints of the wafer transfer robot prototype being out of sync and its end effecter existing vibration , the combi-nation of cross-coupled synchronized control framework and open-loop input shape regulation technology has been successfully adopted to reduce the contour of the robot system and suppress the vibration of the end-effec-tor .Considering the shortage of low frictional coefficient between current convex point supporting materials and the wafer , a novel wafer transfer surface with micro-fi-ber array has been developed to apparently improve the acceleration of wafer transfer and transferring efficiency . To meet the requirement of detecting the contact proper-ties during wafer transfer , a new tactile sensor , based on the piezo-resisitive effect of piezo-sensitive conduc-tive ink ( PSCI ) for measuring 3-D micro-force and the electromagnetic induction of the opposite motion be-tween an permanent magnet and chip inductors for de-tecting stick-slip, has been proposed and its feasibility has been verified by experiments .In this paper , we de-scribed above three parts in details one by one , from the raise of problem, the state-of-art, to our distinct solu-tion and validation .Finally, our research results are summarized based on above analysis and the further re-search is also presented .