Abstract:The system of bisphenol-A diglycidyl ether type epoxy resin(DGEBA) cured with 2-ethyl-4-methylimidazole(2,4-EMI) was studied by means of differential scanning calorimetry(DSC) in isothermal mode.Analysis of DSC curves indicated that the curing reaction could be separated into two stages,the addition reaction and the catalytic polymerization,as proposed in the literatures.The catalytic polymerization reaction has an induction period which decreases with the increasing of curing temperature(T_c).The rate constants for the catalytic polymerization stage were calculated from DSC studies.A curing kinetic model separated into two steps by the induction period was developed based on the reaction mechanism.The model can predict part of the experimental results,but some deviations are observed at the higher values of curing degree(α).A critical value of curing degree(α_c) and a diffusion factor were introduced,and a diffusion controlled curing kinetic model was developed.For the systems of various concentrations of 2,4-EMI cured in the temperature range of 90～120℃,the values of α_c were calculated.The studies show that the diffusion factors affect the curing kinetics greatly in the higher values of α.When the value of α is low,the reaction is controlled by the chemical factors,but it is controlled by diffusion,when α is high.The value of α_c is mainly affected by the glass transition of the system.With the increase of T_c,the curing degree at the glass transition increases and thus the value of α_c increases too.

Cure Kinetic Studies Of A Modified Bismaleimide By Isothermal Dsc Analysis

Modeling the curing kinetics for a modified bismaleimide resin using isothermal DSC

Cure Kinetics of Bismaleimde (BMI) Used for Advanced Polymeric Composite

Study on Curing Kinetics and Thermal Properties of Bismaleimide Resin Containing Ether Linkage

Curing Behavior of the Bismaleimide Containing Ether Linkage and Naphthalene

Studies on Cure Kinetics of Diglycidyl Ether of 4,4′-Bisphenol/4,4′-diaminobiphenyl Using the Advanced Isoconversional Method

Cure Characterization of a New Bismaleimide Resin using Differential Scanning Calorimetry

Synthesis and Cure of Liquid Crystalline Diallyl Modifiers for Bismaleimide Resin

Cure Kinetics of an Epoxy Resin Containing Naphthyl/dicyclopentadiene Moieties and Bis‐phenoxy (3‐hydroxy) Phosphine Oxide System and Properties of Its Cured Polymer

Building of Cure Kinetic Model in Modified Bismeleimide Resin During Curing Process

Nonisothermal reaction kinetics of DGEBA with four-armed starlike polyamine with benzene core (MXBDP) as novel curing agent

Model-Fitting and Model-Free Nonisothermal Curing Kinetics of Epoxy Resin with A Low-Volatile Five-Armed Starlike Aliphatic Polyamine

Study on Cure Reaction of the Blends of Bismaleimide and Dicyanate Ester

Study on the Polyethersulfone/bismaleimide Blends: Morphology and Rheology During Isothermal Curing

Cure Kinetics Of Carbon Fiber/Bismaleimide Prepreg

Studies on the Phase Separation of Poly(Ether Imide)‐Modified Cyanate Ester Resin

Cure Kinetics and Activation Energy Studies of Modified Bismaleimide Resins

Comparative study of the kinetic behaviors and properties of aromatic and aliphatic bismaleimides

CURING KINETIC MODEL OF THE 2-ETHYL-4-METHYLIMIDAZOLE/EPOXY SYSTEM

Study on the Cure Kinetics of Middle Temperature Curing 3234 Epoxy Resin System