Microstructure Of Rehandled Layer On The Surface Of Nano-Cucr Alloy

Jia Cheng,Heng Zhang,Zhi-Mao Yang,Bing-Jun Ding
2010-01-01
Abstract:Nano-CuCr25 and nano-CuCr50 alloys are prepared by vacuum hot pressing using powders activated by high energy ball-milling. The surface of the alloys after arc erosion and the rehandled layer are studied. The depth of the rehandled layer on nano-CuCr50 is found to be 3 similar to 6 micrometers at low current and the microstructure is refined. At high-current, the rehandled layer of nano-CuCr25 is found to be about 3 similar to 4 micrometers. Compared with normal CuCr25 alloy, nano-CuCr25 is more stable as cathode. Anode spots which can destroy the contact occur at high-current. Arc energy of nano-CuCr25 is lower than that of normal CuCr25 alloy.
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