Abstract:A radio-frequency micro-electro-mechanical system (RF MEMS) wafer-level packaging (WLP) method using pre-patterned benzo-cyclo-butene (BCB) polymers with a high-resistivity silicon cap is proposed to achieve high bonding quality and excellent RF performance. In this process, the BCB polymer was pre-defined to form the sealing ring and bonding layer by the spin-coating and patterning of photosensitive BCB before the cavity formation. During anisotropic wet etching of the silicon wafer to generate the housing cavity, the BCB sealing ring was protected by a sputtered Cr/Au (chromium/gold) layer. The average measured thickness of the BCB layer was 5.9 mu m. In contrast to the conventional methods of spin-coating BCB after fabricating cavities, the pre-patterned BCB method presented BCB bonding layers with better quality on severe topography surfaces in terms of increased uniformity of thickness and better surface flatness. The observation of the bonded layer showed that no void or gap formed on the protruding coplanar waveguide (CPW) lines. A shear strength test was experimentally implemented as a function of the BCB widths in the range of 100-400 mu m. The average shear strength of the packaged device was higher than 21.58 MPa. A RF MEMS switch was successfully packaged using this process with a negligible impact on the microwave characteristics and a significant improvement in the lifetime from below 10 million to over 1 billion. The measured insertion loss of the packaged RF MEMS switch was 0.779 dB and the insertion loss deterioration caused by the package structure was less than 0.2 dB at 30 GHz.

An Analytical Method for Optimization of Rf Mems Wafer Level Packaging with Cpw Detuning Consideration

A Pre-Shaped Wafer Level Packing Strategy for Rf Mems

A Parameter Design Method for High Performance LCLC-LC Compensated CPT Systems

A Novel Wafer Level Package Strategy For Rf Mems

Wafer-Level Packaging Method For Rf Mems Applications Using Pre-Patterned Bcb Polymer

Optimization of Multiple- Tx Magnetic Coupling Structure of Wireless Charging System Based on Orthogonal Method

MMIC on-Wafer Test Method Based on Hybrid Balanced and Unbalanced RF Pad Structures

An Improved Design Method Based on a Multi-Plate Coupler Structure for Capacitive Power Transfer with Wide Ranges of Misalignment and Loads

Parasitic Effects Reduction for Wafer-Level Packaging of RF-Mems

Hybrid Electromagnetic Boundary for Cavity Resonance Suppression

A Hybrid Boundary Scheme For Reducing Rectangular Waveguide Cutoff Frequency

Efficient Coupling of Evanescent Waves in Rectangular Waveguides Based on Ultrathin Planar Capacitive Metasurfaces

A Fully Parameterized Fem Model for Electromagnetic Optimization of an RF Mems Wafer Level Package

Wafer Level Micropackaging for RF MEMS Switches

Design And Analysis Of Metamaterials For Wireless Power Transfer With Same Resonance Frequency But Different L/C Combinations

Analysis of Smt Decoupling Capacitor Placement in Electronic Packages Using Hybrid Modeling Method

Design and Validation of Single-Layer Evanescent Wave Absorber in Rectangular Waveguide

Research status of wafer level packaging for RF MEMS switches

Modeling and Optimization of Substrate Electromagnetic Coupling and Isolation in Modern Lightly Doped CMOS Substrate

CAD Models for a Boxed Coplanar Waveguide with Multilayered Substrates and Overlays

Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar Applications