Investigation of Radiation Hardening by Back-Channel Adjustment in PDSOI MOSFETs

Chunmei Liu,Huilong Zhu,Xin Xie,Zhiyuan Hu,Dawei Bi,Zhengxuan Zhang,Shichang Zou
DOI: https://doi.org/10.1109/tns.2021.3115116
IF: 1.703
2021-01-01
IEEE Transactions on Nuclear Science
Abstract:Total ionizing dose (TID) degradation is caused by radiation-induced charge buildup in oxides. Radiation hardening of silicon-on-insulator (SOI) devices with deep submicrometer nodes or nanonodes is mainly concerned with the field oxide and buried oxide. In this article, a back-channel adjustment technique for TID hardening is proposed. The technique is compatible with the 130-nm partially depleted silicon on an insulator (PDSOI) commercial process with no extra effort applied to the design. After testing the key electrical parameters and characterizing the radiation tolerance of the typical T-gate I/O nMOS devices, the results show that the radiation tolerance of the devices can reach more than 1 Mrad(Si) with the back-channel adjustment technique, and electrical performance is comparable to that of commercial process devices.
What problem does this paper attempt to address?