Deep Transfer Wasserstein Adversarial Network for Wafer Map Defect Recognition

Jianbo Yu,Shijin Li,Zongli Shen,Shijin Wang,Changhui Liu,Qingfeng Li
DOI: https://doi.org/10.1016/j.cie.2021.107679
IF: 7.18
2021-01-01
Computers & Industrial Engineering
Abstract:Deep neural networks (DNNs) are capable of extracting effective features from data by using deep structure and multiple non-linear processing units. However, they dependent on large datasets from the same distribution. It is difficult to collect wafer maps with various defect patterns in semiconductor manufacturing process. A new deep transfer learning model, deep transfer Wasserstein adversarial network (DTWAN) is proposed to recognize wafer map defect. An adaptive transfer learning framework based on adversarial training is proposed for DTWAN, where multi-stage optimization based on the maximum mean discrepancy (MMD), cross entropy, and adversarial loss is performed. Finally, a generative adversarial algorithm is developed to guide the model to extract general features from source and target domain. DTWAN transfers the key knowledge of the source domain data to target domain, and effectively reduces cost of data collection and improve industrial applicability of the recognition model. The effectiveness of DTWAN is verified on the transfer learning tasks from simulation wafer maps to real wafer maps. The testing results indicate that DTWAN is superior to those typical transfer learning algorithms in WMDR. This study will provide effective guidance to transfer knowledge of simulation data that are easy to collect to real manufacturing processes.
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