Abstract:Due to the complexity and dynamics of the semiconductor manufacturing processes, wafer bin maps (WBM) present various defect patterns caused by various process faults. The defect type detection on wafer maps provides information about the process and equipment in which the defect occurred. Recently, automatic inspection has played a vital role in meeting the high-throughput demand, especially with deep convolutional neural networks (DCNN) which shows promising efficiency. At the same time, the need for a large amount of labeled and balanced datasets limits the performance of such approaches. In addition, complex DCNN in recognition tasks can provide redundant features that cause overfitting and reduce interpretability. In this paper, a new hybrid deep model for wafer map fault detection to get over these challenges is proposed. Firstly, a new convolutional autoencoder (CAE) is employed as a synthetization model to fix the high imbalance problem of the dataset. Secondly, for efficient dimensionality reduction, an embedding procedure is applied to the synthesized maps to get sparse encoded wafer maps by reinforcing a sparsity regularization in an encoder-decoder network to form a sparsity-boosted autoencoder (SBAE). The sparse embedding of wafer maps guarantees more discriminative features with 50% reduction in spatial size compared to the original wafer maps. Then, the 2D encoded sparse maps are converted to 1D sinograms to be fed later into another aggressive feature reduction stage using a new modified red deer algorithm with a new tinkering strategy. The resultant feature pool is reduced to ~ 25 1D feature bases, i.e., ~ 1.5% of the initial size of the 2D wafer maps. Finally, for the prediction stage, a simple 1DCNN model is introduced. The proposed inspection model is tested via different experiments on real-world wafer map dataset (WM-811K). Compared to state-of-the-art techniques, the proposed model outperforms their performance even with small-sized 1D feature pool. The average testing accuracy are 98.77% and 98.8% for 9 and 8 types of faults, respectively.

An End-to-end Wafer Map Defect Recognition Model

Wafer map defect pattern detection method based on improved attention mechanism

Recognition and Classification of Mixed Defect Pattern Wafer Map Based on Multi-Path DCNN

AI classification of wafer map defect patterns by using dual-channel convolutional neural network

Wafer Map Defect Patterns Semi-Supervised Classification Using Latent Vector Representation

Convolutional Neural Networks for Multi-Stage Semiconductor Processes

A Deep Convolutional Neural Network for Wafer Defect Identification on an Imbalanced Dataset in Semiconductor Manufacturing Processes

A Model for Generating Wafer Defect Maps

Wafer Map Defect Classification Using Autoencoder-Based Data Augmentation and Convolutional Neural Network

Convolutional Neural Network for Semiconductor Wafer Defect Detection

A Deep Convolutional Neural Network-Based Multi-Class Image Classification for Automatic Wafer Map Failure Recognition in Semiconductor Manufacturing

Wafer maps defect recognition based on transfer learning of handwritten pre-training network

A Deep convolutional neural network with residual blocks for wafer map defect pattern recognition

A Global-Local Feature Multilevel Fusion Network for Chip Defect Segmentation

A novel joint segmentation approach for wafer surface defect classification based on blended network structure

Sparse deep encoded features with enhanced sinogramic red deer optimization for fault inspection in wafer maps

Applying Data Augmentation and Mask R-CNN-Based Instance Segmentation Method for Mixed-Type Wafer Maps Defect Patterns Classification

Efficient Mixed-Type Wafer Defect Pattern Recognition Using Compact Deformable Convolutional Transformers

A Light-Weight Neural Network for Wafer Map Classification Based on Data Augmentation

Wafer map failure pattern classification using geometric transformation-invariant convolutional neural network