Abstract:Due to the high complexity and dynamics of the semiconductor manufacturing process, various process abnormality could result in wafer map defects in many work stations. Thus, wafer map pattern recognition (WMPR) in the semiconductor manufacturing process can help operators to troubleshoot root causes of the out-of-control process and then accelerate the process adjustment. This article proposes a novel deep neural network (DNN), two-dimensional principal component analysis-based convolutional autoencoder (PCACAE) for wafer map defect recognition. First, a new convolution kernel based on conditional two-dimensional principal component analysis is developed to construct the first convolutional block of PCACAE. Second, a convolutional autoencoder is cascaded by considering the nonlinearity of data representation. The second convolutional block of PCACAE is constructed based on the encoding part. Finally, the pretrained PCACAE is fine-tuned to obtain the final classifier. PCACAE is successfully applied for feature learning and recognition of wafer map defects. The experimental results on a real-world case demonstrate that PCACAE is superior to other well-known convolutional neural networks (e.g., GoogLeNet, PCANet) on WMPR.

What problem does this paper attempt to address?

The paper primarily focuses on addressing the issue of wafer map defect recognition during the semiconductor manufacturing process. Against the backdrop of the complexity and dynamism of semiconductor manufacturing, various process anomalies may lead to defects on wafer maps at workstations. Wafer Map Pattern Recognition (WMPR) can assist operators in quickly locating the root causes of out-of-control processes in such an environment, and accelerate process adjustments, thereby improving production efficiency, reducing scrap rates, and avoiding substantial cost losses due to large-scale wafer defects. The paper proposes a novel Deep Neural Network (DNN), namely the Convolutional Autoencoder based on Two-Dimensional Principal Component Analysis (PCACAE), for wafer map defect recognition. This method first develops a new convolutional kernel based on conditional two-dimensional principal component analysis to construct the first convolutional block of PCACAE. Secondly, it cascades the convolutional autoencoder by considering the nonlinearity of data representation. Finally, the pre-trained PCACAE is fine-tuned to obtain the final classifier. Experimental results show that PCACAE has superiority in wafer map pattern recognition compared to other well-known convolutional neural networks (such as GoogLeNet, PCANet), especially in the recognition of small categories, while maintaining a lower computational cost. The core contributions of the paper include proposing a new semi-supervised algorithm—Conditional Two-Dimensional Principal Component Analysis (C2DPCA), for extracting effective features from wafer maps with class imbalance; designing a new deep network structure—Convolutional Autoencoder (CAE) based on C2DPCA kernels, to further extract abstract features from input feature maps; and adopting a hierarchical pre-training initialization method to achieve minimal initial error and rapid convergence, making the performance of PCACAE in wafer map defect detection comparable to or better than existing deep neural networks, especially in terms of performance on small categories.

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