Improvement of Dimensional Accuracy and Surface Quality of Microlens Arrays by a Profile Cutting Method

Zhou Tianfeng,Ruan Benshuai,Yu Qian,Zhou Jia,Beijing Institute of Technology Chongqing Innovation Center,Zhao Wenxiang,Wang Xibin
DOI: https://doi.org/10.1007/s00170-021-07072-9
IF: 3.563
2021-01-01
The International Journal of Advanced Manufacturing Technology
Abstract:Single-point diamond cutting is an efficient method to fabricate microlens arrays (MLAs). However, machining MLAs at the microscale with high dimensional accuracy and a smooth surface finish is a difficult task. In this study, a method of profile cutting is proposed to machine MLAs on electroless nickel–phosphorus (Ni–P) plating. To improve the dimensional accuracy of MLAs, a precision tool setting method is introduced, via which the precision of MLA sag can be controlled to within 20 nm. In addition, the formation mechanism of corrugation defects is studied via a finite element (FE) simulation of the wedge nano-cutting process and a cutting experiment of concentric ring grooves. By optimizing the tool settings and the machining parameters, high-quality MLAs with apertures of Φ100 μm can be created.
What problem does this paper attempt to address?