Molecular dynamics simulation of out-of-plane thermal conductivity of doped silicon nanofilms

Hui Chen,Zhiyong Wei,Weiyu Chen,Chenhan Liu,Kedong Bi,Yunfei Chen
DOI: https://doi.org/10.3969/j.issn.1001-0505.2017.03.013
2017-01-01
Abstract:The out-of-plane thermal conductivities of both pure silicon nanofilm and that doped with germanium (Ge) with film thicknesses ranging from 2.2 to 104.4 nm were calculated by non-equilibrium molecular dynamics (NEMD) simulation at an average temperature of 300 K.Ge atoms were doped in a random pattern with a doping density of 5% and 50%,respectively.The results show that there is a large reduction in thermal conductivities of the silicon nanofilm after doping with the same thickness.The out-of-plane thermal conductivity of the Ge-doping silicon nanofilm as well as that of a pure one increases with the increase of the film thickness.By calculating the thermal conductivity accumulation function in terms of phonon mean free path (MFP),it indicates that at 300 K the dominant contribution to the bulk thermal conductivity of pure silicon comes from phonons with MFPs between 2 and 2 000 nm,while the MFPs of phonons that contribute about 80% to the bulk thermal conductivity of Ge-doping silicon are between 0.1 and 30 nm,thus they are much less than those of the pure silicon.
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