Out-of-plane Thermal Conductivity of Polycrystalline Silicon Nanofilm by Molecular Dynamics Simulation

Shenghong Ju,Xingang Liang,Xianghua Xu
DOI: https://doi.org/10.1063/1.3633232
IF: 2.877
2011-01-01
Journal of Applied Physics
Abstract:The out-of-plane thermal conductivity of polycrystalline silicon nanofilm is investigated by molecular dynamics simulation. The polycrystalline silicon nanofilm with a random shape of grains is generated by the three-dimensional Voronoi tessellation method. The out-of-plane thermal conductivity of polycrystalline silicon nanofilm at different temperature, film thickness, and average grain size is calculated by the Muller-Plathe method. The results indicate that the polycrystalline thermal conductivity is lower than that of the bulk single crystal and the single crystal nanofilm of silicon. The out-of-plane thermal conductivity of polycrystalline silicon nanofilm is insensitive to temperature and film thickness that is apparently larger than grain size, but mainly depends on the grain size.
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