Experimental Study on Spray Etching of Printed Circuit Heat Exchanger Channels

Fei XIN,Ting MA,Qiu-Wang WANG
2017-01-01
Journal of Engineering Thermophysics
Abstract:Printed circuit heat exchanger (PCHE),as a new type of high compact heat exchanger,can work under high-temperature and high-pressure conditions to transfer great heat.Using chemical etching technology can etch PCHE heat transfer unit channels from micron to millimeter level.In order to optimize etching process conditions,improve the etching rate and reduce the influence of black sediment for etching quality,this paper adopts orthogonal spray etching method to study the influence of spray pressure,etchant components and their concentration,etching temperature on the 201 stainless steel etching quality of the etching rate,lateral erosion and surface roughness.Through orthogonal spray etching experiment,we have obtained the optimum combination conditions of each factor in the setting level,and that is spray pressure 0.25 MPa,etching temperature 35℃,FeCl3 concentration 350 g·L-1,H3PO4 concentration 1.5 mol/L in the etchant,which is beneficial to realize the low-cost,high-efficiency and controllable process of PCHE heat transfer unit production.
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