Miraculous Light Enabling Processing of Magic Materials

Minlin Zhong,Peixun Fan
DOI: https://doi.org/10.3969/j.issn.1009-2412.2016.05.005
2016-01-01
Abstract:Graphene, a one-atom thick layer of graphite with densely packed carbon atoms, has been extensively investigated since its first generation in 2004.Depending on its unique properties, graphene is considered to be the next-generation materials of transistors, transparent conductive electrodes and in other applications.The properties of graphene, such as electronic structure and optical transparency are functions of its number of layers (NOL).Therefore, it is significantly important to accurately control the number of graphene layers.Although many groups have reported the synthesizing of monolayer or bilayer graphene, to control the NOL in graphene synthesis is still challenging.Laser is one of the most advanced materials processing and manufacturing methods at present, which has played an important role in the modern manufacturing industry.It has become one of the international research focuses on the advanced manufacturing technologies.The high brightness, high directivity, high monochromaticity and the typical multidimensional characteristics as well as extreme technological parameters of laser render it unique advantages in processing graphene.Depending on the above hotspots in graphene and laser materials processing research, we propose a new method for precise thinning and patterning graphene as well as tuning its properties by laser irradiation.The pristine graphene with 5 layers was thinned to 2 layers by CO2 laser in vacuum by vary the laser power density and irradiation time.The thinning process was also achieved by picosecond laser in atmosphere, with multilayer graphene being precisely thinned to specific layer number (1-layer, 2-layer, 3-layer, etc) via only one-step laser processing.The patterned thinning was achieved by programing the laser scanning path.We demonstrate a picosecond laser thinning removal of graphene.Besides, the femtosecond laser was used in patterned cutting graphene.Both monolayer and multilayer graphene can be efficiently and accurately cut into desired device structures with different patterns and dimensions.Compared to other graphene thinning and patterning methods, the laser based processes utilized in this paper have many advantages such as one-step process, non-contact operation, substrate and environmental-friendly, highly flexible and efficient, making them promising in the fabrication of graphene-based optoelectronic functional devices.
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