Atomic Diffusion and Interface Reaction During Diffusion Bonding of SiC/Ti under Alternating Electric Field

SUN Dongli,ZHANG Ningbo,WANG Qing,LI Qihai,HAN Xiuli
DOI: https://doi.org/10.11918/j.issn.0367-6234.2016.11.010
2016-01-01
Abstract:In order to obtain the influence of electronic on the diffusion behavior of atoms and interfacial reaction, diffusion bonding between SiC and Ti under alternating electric field was carried out. The influence of the intensity of AC( DC) electric field on the interfacial microstructure, atomic diffusion and shear strength were characterized by means of scanning electron microscopy( SEM) , energy disperse spectroscopy ( EDS) , X-ray diffraction( XRD) and shear test. The mechanism of diffusion bonding under electric field was also discussed. The results showed that in the stage of pore closure interfaces contact tightly because of the great image interaction Image interaction increased obviously with the increase of voltage and decrease of interface distance. In diffusion reaction stage, the atom diffusion flux increased by applying voltage, illustrating that the applied voltage promoted the diffusion of the atom at SiC/Ti interface. The promoting effect was more obvious as the voltage increased. Electrodes effects existed in DC electric field while no electrodes effects existed in AC electric field. Under conditions 950 ℃/1. 5 h/7.5 MPa/400 V(AC), bonding Strength reached 63.8±9.4 MPa, and the order of structure of interface was SiC/TiC/TiC+Ti5 Si3/Ti. Electric field promoted atomic diffusion to a certain extent and improved the efficiency of diffusion bonding.
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