On the Microstructure of Immersion Silver on Sputtered Copper

TANG Dian,WEI Zhe-liang,YOU Shao-xing,SHAO Yan-qun
DOI: https://doi.org/10.3969/j.issn.1672-4348.2005.03.001
2005-01-01
Abstract:Electrochemical deposition of silver onto copper substrates by immersion method has been one of the keenly interested topics. In this study, ethanol was used as the plating solution in which some chemicals were added. The silver deposits were characterized by a field emission scanning electron microscopy (FESEM) and an atom force microscope (AFM). It was found that silver immersion using ethanol-based bath had a good coverage feature. The upper strata of the copper substrate were coated by silver particles whose size was around 15 nm. At lower strata, the size of the silver particles was about 10 nm.
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