Effect of La2O3 particles on structure and properties of Sn-58Bi solder after multi-remelting

Xiliang QIU,Hongmei WEI,Qian WANG,Peng HE,Tiesong LIN,Fengjiao LU

DOI: https://doi.org/10.11951/j.issn.1005-0299.20150104

IF: 1.8

2015-01-01

Materials Science and Technology

Abstract:To improve the solderability of the Sn-58Bi solder, the Sn-58Bi composite solder reinforced with different mass fraction of La2 O3 particles was prepared by mechanical mixing method. The effect of La2 O3 particles on microstructures, melting characteristics and mechanical properties of the Sn-58Bi solder was investigated by SEM, EDS and DSC analytical methods, and the microstructure evolution of intermetallic layer along interface of Sn-58Bi-xLa2 O3/Cu soldered joint after multi?remelting was also discussed. Results indicated that the addition of La2 O3 particles to the solder inhibited the segregation orientation of large pieces of Bi?rich phase, but had no obvious effect on the soldered melting point. The grain size of the intermetallic layer along interface of the same soldered joint was increased with the increasing of remelting time, but the addition of La2 O3 particles to the solder hindered the grain coarsening of the intermetallic layer along interface. After adding different mass fraction of La2 O3 particles to the solder, the hardness and modulus of the composite solder and its ability of resistance to local deformation and cracking had been improved for a certain degree.