Novel benzoxazine/epoxy/phenolic molding compound and its thermal stability

Haiyan MOU,Guangchao XIE,Kelai ZHOU,Yun LU
DOI: https://doi.org/10.3969/j.issn.1001-9731.2017.03.029
2017-01-01
Abstract:Benzoxazine/epoxy/phenolic resin based molding compounds were prepared by introducing benzoxazine into molding compound formula and their thermal stability was studied.The property test results revealed that there was no working ability issue in the application of benzoxazine/epoxy/phenolic molding compound.Comparing with epoxy/phenolic molding compound, Tg of benzoxazine/epoxy/phenolic molding compound increased by 20 ℃ and the water absorption decreased by 47% with a filler ratio of 78%.With lower loading of flame retardant, the flammability of benzoxazine/epoxy/phenolic molding compound was at the same level as epoxy/phenolic molding compound.The performance of epoxy/phenol molding compound deteriorated during storage at 225 ℃ for 500 h, including flexural strength, adhesion, weight loss and Tg, while the properties of benzoxazine/epoxy/phenolic molding compound were much more stable.TO247 units molded with epoxy/phenolic molding compound were able to pass thermal cycle test (-50/200 ℃, 1 000 cycles) without delamination, but TO247 units molded with benzoxazine/epoxy/phenolic molding compound passed thermal cycle test (-50/225 ℃, 1 000 cycles).
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