Studies on electroless plating Ni-P alloy film on Al substrate and electrical property of Al/Ni-P/Cu composite

Guohong CHEN,Jian ZHANG,Ruoming WANG,Chunhui MIAO,Zhixiang ZHENG,Wenming TANG

DOI: https://doi.org/10.3969/j.issn.1001-9731.2016.增刊(Ⅰ).002

2016-01-01

Abstract:Electrolessplating Ni-P alloy layer can enhance the plating ability of Cu on Al substrate.In this paper, a method for fabricating Al/Cu composite was introduced by electroless plating Ni-P alloy layer followed by e-lectroplating Cu.Planar and cross-sectional morphologies,compositions and formation mechanism of the elec-trolessplating Ni-P alloy layer and microstructure and electrical properties of the Al/Ni-P/Cu composite were investigated.The results show that Ni-P alloy particles are preferentially deposited on corrosion pits and em-bossments on Al surface,and gradually a continuous Ni-P alloy film was formed.A uniform and dense Ni-P al-loy layer of 5μm in thickness was deposited on Al substrate after electroless Ni-P alloy plated in the alkali solu-tion for 5 min and the in the acidic solution for 25 min.After electroplating a thick Cu layer of 140μm in thick-ness,the Al/Ni-P/Cu composite has an electrical resistivity of 2.92×10-8 Ω.m.After heat treated at 150 ℃for 360 h,interdiffusion between Al and Cu is not detected,and electrical resistivity of the Al/Ni-P/Cu com-posite is just 3.04×10-8 Ω.m,indicating that microstructure and electrical resistivity of the composite are ex-tremely steady.