Three-dimensional micro strain gauges as flexible, modular tactile sensors for versatile integration with micro- and macroelectronics
Chen Xu,Yiran Wang,Jingyan Zhang,Ji Wan,Zehua Xiang,Zhongyi Nie,Jie Xu,Xiang Lin,Pengcheng Zhao,Yaozheng Wang,Shaotong Zhang,Jing Zhang,Chunxiu Liu,Ning Xue,Wei Zhao,Mengdi Han
DOI: https://doi.org/10.1126/sciadv.adp6094
2024-08-23
Abstract:Flexible tactile sensors play important roles in many areas, like human-machine interface, robotic manipulation, and biomedicine. However, their flexible form factor poses challenges in their integration with wafer-based devices, commercial chips, or circuit boards. Here, we introduce manufacturing approaches, device designs, integration strategies, and biomedical applications of a set of flexible, modular tactile sensors, which overcome the above challenges and achieve cooperation with commercial electronics. The sensors exploit lithographically defined thin wires of metal or alloy as the sensing elements. Arranging these elements across three-dimensional space enables accurate, hysteresis-free, and decoupled measurements of temperature, normal force, and shear force. Assembly of such sensors on flexible printed circuit boards together with commercial electronics forms various flexible electronic systems with capabilities in wireless measurements at the skin interface, continuous monitoring of biomechanical signals, and spatial mapping of tactile information. The flexible, modular tactile sensors expand the portfolio of functional components in both microelectronics and macroelectronics.