Influence of Physical Parameters of Phase-change Film on Thermal Control of Electronic Devices

Li-kai MAO,Wen-long CHENG,Yong-le NIAN
DOI: https://doi.org/10.19659/j.issn.1008-5300.2018.06.007
2018-01-01
Abstract:Phase change thermal control technology is one of the important methods for passive thermal control.The experimental research and numerical simulation for the thermal control of electronic equipment using flexible phase change film materials are carried out, and the influence of the physical parameters of phase-change materials and the experimental parameters on the thermal control are obtained.The results show that the specific heat capacity and the latent heat of the phase-change material have little effects on thermal control, while the thermal conductivity and the thickness of the phase-change material, the heat flux from the chip and the heat source area factor have a large influence on thermal control.When the system reaches thermal balance, the central temperature of the heat source is negatively correlated with the thermal conductivity and the thickness of the phasechange material and the heat source area factor, and is positively correlated with the heat flux.
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