Study on Copper Foil Surface Roughening Technology

ZHANG Shi-chao,SHI Wei-yu,BAI Zhi-ming
DOI: https://doi.org/10.3969/j.issn.1001-3849.2005.05.001
2005-01-01
Abstract:Copper foil is used widely in electronic industries and has been employed as a material for producing printed wiring board and lithium ion batteries. Before it is used, copper foil should be subjected to an electrochemical surface treatment to improve its bond strength. Traditional copper surface roughening treatment involve the use of arsenide-containing electrolyte which is harmful to environment. A process of treating the surface of copper foil in an electrolytic bath containing TiSO_4 and Na_2WO_4 without using harmful arsenide was investigated. Through above-mentioned treatment, a uniform rough layer with high value of Ra can be produced.
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