Influences of Elevated Temperature and Humidity on Breakdown Characteristics of Polyimide Film

LUO Yang,WU Guangning,LIU Jiwu,PENG Jia,GAO Guoqiang,SUN Jixing,ZHU Guangya
DOI: https://doi.org/10.13334/j.0258-8013.pcsee.2014.36.026
2014-01-01
Abstract:Polyimide (PI) film has been widely applied as electrical insulation for wires and cables due to its excellent electrical, mechanical and thermal properties. However, PI insulation could be degraded because of various environmental stresses, which can cause deterioration of their insulation properties. In this paper, the effects of thermal exposure on dielectric strength of nanocomposite PI film and pure PI film were investigated. The comparison of the breakdown field strength of single layer film, double layer films and three layer films were also studied. The influence mechanism of humidity on the breakdown strength was analyzed. The results show that the breakdown field strength of PI films, both nanocomposite PI film and pure PI film, is greatly decreased with the tested temperature increasing. And the decreasing rate of breakdown field strength increases more obviously when the tested temperature is more than 350℃. It is due to the motion and pyrolysis degradation of PI macromolecules caused by overheating. The single film possesses better heat dissipation potential and homogeneous micro-structure. Therefore the breakdown field strength of single layer film is higher than those of double layer films and three layer films. Higher thermal conductivity of nanocomposite PI film has the better breakdown stability in high temperature environment. Some hydrogen bonds exist between water molecule and carboxyl in the backbone chain of PI polymer. The hydrolysis reaction of PI macromolecule would make the dielectric strength of PI film decrease.
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