Preparation and Properties of Low Viscosity Silicon-containing Arylacetylene Resin

Ye Shen,Jiadong Zhan,Yang Tong,Qiaolong Yuan,Farong Huang,Lei Du
DOI: https://doi.org/10.3969/j.issn.1009-9239.2015.02.003
2015-01-01
Abstract:A low viscosity silicon-containing arylacetylene resin(PSA) was prepared by adding reactive dilu-ent to PSA, and the rheological property and curing process of the viscosity PSA, the thermal property, mechanical properties, and dielectric properties of the cured PSA were studied. The results show that the addition of reactive diluent to PSA could make its viscosity decrease siginificantly. The thermal decompo-sition temperatures at 5% weight loss of the cured PSA reach 665.5℃ in nitrogen and 603.3℃ in air, and its residual rate at 800℃ is 89.7% and 53.8%, respectively. The glass transition temperature of the cured PSA is higher than 500℃. The bending strength of the PSA attains 30 MPa after adding 10% of reactive diluent, the bending modulus changes little, and the permittivity and loss tangent are less than 3.20 and 0.005 at 25℃ ranging from 101 Hz to 106 Hz.
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