Highly heat‐resistant branched silicon‐containing arylacetylene resins with low curing temperature

Zhipeng Ling,Junli Zhu,Chunhua Cai,Jiaping Lin,Liquan Wang,Lei Du
DOI: https://doi.org/10.1002/pi.6254
IF: 3.213
2021-05-24
Polymer International
Abstract:<p>Silicon‐containing arylacetylene (PSA) resins exhibit excellent thermal stability. However, the high curing temperature limits their applications. Herein, we report that changing the topology of PSA resins from linear to branched effectively decreases their curing temperature with no deterioration of thermal stability. Two sets of resins based on silyleneethynylene‐naphthalene‐ethynylene (SNP) and silyleneethynylene‐phenyl‐ethynylene (SPN) repeating units are studied. It was found that the branched resins possess considerably lower thermal curing temperatures than their linear counterparts. The exothermic peaks for branched SNP (BSNP) and branched SPN (BSPN) are about 190 °C and 214 °C, respectively, which are 18 °C and 25 °C lower than that of their linear counterparts (<i>i.e.</i>, PSNP and PSPN). Density functional theory (DFT) was applied to theoretically explain the differences in the thermal curing temperature between the linear and branched resins. The lower curing temperature of the branched PSAs is assigned to the more terminal alkyne groups per molecule which increases the reactivity of the curing reaction to form into the crosslinked structure. In addition, the <i>T</i><sub>d5</sub> (the temperature at 5% mass loss) for BSNP and BSPN resins are 653 °C and 613 °C, respectively, which are comparable to those for their linear counterparts.</p><p>This article is protected by copyright. All rights reserved.</p>
polymer science
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