Construction and Manufactrue Process of Pancakes in Condution Cooling Smes Winding

田波,曹昆南,任丽,张敬因,洪辉,宋萌,李强,王立中,牛国俊,信赢,龚伟志,熊志全,杨昆,胡南南,焦丰顺,李敬东
DOI: https://doi.org/10.3969/j.issn.1006-7345.2015.02.026
2015-01-01
Abstract:High temperature superconductive magnetic energy storage ( SMES) could store electromagnetic energy, and release en-ergy when needed.There are many differences between common superconducting coils and the SMES windings.First, the working environment temperature of SMES windings work is generally much lower than 77K, so that conduction cooling method is usually a-dopted, and an efficiency cooling construction design is important to maintain SMES windings running.Second, in SMES, heat con-ducting paths should be insulated from electrical elements, so that the insulation design is fundamental consideration for the electric properties of the windings.Third, the SMES windings should withstand strong surge of electromagnetic force when charging or relea-sing energy, so high mechanical strength is a key of ensuring the windings normal operating.In this paper, a construction and its manufacture process of pancakes, which was used to constitute a SMES winding, were introduced, the specialties of this construction is that the superconducting tapes and the heat conducting parts, such as heat-leading plates, heat-leading blocks, together with the insulation lays between them, were all solidified into an integral pancake by the way of vacuum impregnation, this construction had high heat conducting efficiency, sufficient insulation strength, and improved mechanical strength.According to this design, we fin-ished a 100 kJ SMES winding, which was made from Bi-2223 tapes, comprised of 28 pancakes, and working in 20K environments, whose inner and outer diameter were 456mm and 486mm.The pancakes had high cooling efficiency, sufficient insulating and me-chanical strength.Compared with traditional manufacture technologies products, this SMES windings had nice appearance, high level of integration, and could be assembled in modularized method.
What problem does this paper attempt to address?