Simulation of Temperature Field of Copier Paper Based on Wavelet Finite Element Method

杨胜军,马军星,薛继军,何正嘉
DOI: https://doi.org/10.3969/j.issn.1004-731x.2002.09.034
2002-01-01
Abstract:The simulation of temperature field of copier paper in the copier fusing is very important for improving the fusing property of reprography. The temperature field of copier paper varies with high gradient when the copier paper moving through the fusing rollers. By means of conventional shaft elements, the high gradient temperature variety causes the oscillation of the numerical solution. Based on the Daubechies scaling functions, a kind of wavelet-based element is constructed for the above problem. The temperature field of the copier paper moving through the fusing rollers is simulated using the two methods. The comparison of the results shows the advantages of the wavelet finite element method, which provide a new method for improving the copier properties.
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