Abstract:New electronic systems for automation/industrial controlling/medicine/aerospace will continue to challenge both packaging engineers and technology due to the increased performance requirements,higher densities,higher temperatives and limited space available.This challenge mandates the use of unique packaging techniques such as Low Temperature Co-fired Ceramic(LTCC) technology that not only provide the increase circuit density but also the reliability,electrical and transfer performance,thermal management,and hermeticity.Low Temperature Co-fired Ceramic(LTCC) technology is a new packaging technology for integrate circuit,which consists of buried passive devices such as transformer,conductors,resistors,and capacitors in the multilayer of module and can easily integrate with active devices such as power MOS,transistors,and IC module.Recently,this technology was widely focused and researched for its wonderful properties.Focused on the LTCC materials,some researches were carried as follows: 1.A low temperature sintering model was established based on the liquid sintering theories.The sintering temperature and sintering time dependence of relative density for the sintered ceramics were simulated.2.With the systemically analyses of the synthesis of ferroelectric-ferromagnetic composite materials,the low temperature sintered NiCuZn ferrites and perovskite BaTiOk+X was chosen as the main components.A model was given by assuming the isolation of magnetic grains by surrounding non-magnetic layer to evaluate the internal field and the complex permeability of whole material as a function of the ratio of perovskite content to ferrite content.3.The effects of preparation process on the microstructure and electromagnetic properties of ceramics are researched.The pre-sintering temperature,milling time,firing rate,sintering temperature,and holding time are changed regularly to investigate the variation of the phase formation by X-ray diffraction studies,the micrographs of the sintered ceramics by SEM,and the bulk density by Archimedes method.The frequency dependence of complex permeability,quality factor,and dielectric constant are studied.4.The effects of sintering temperature and Mn ions contents on the microstructure and electromagnetic properties of NiZn ferrites are studied.To decreased the sintering temperature,CuO was introduced in NiZn ferrites first,and then the flux oxides such as Bi2O3,WO3,and Nb2O5 are introduced in NiCuZn ferrites.The variation of microstructure and electromagnetic properties with these reducing-sintering-temperature oxides’ content are investigated.Finally,the influence of rare earth ions Ce4+ on low temperature sintered NiCuZn ferrites are researched.5.A new ferroelectric-ferromagnetic composite material is synthesized by usual ceramic technology with NiCuZn ferrites and perovskite BaTiOk+X as the main components.The microstructure and electromagnetic properties of the composite with different composition of NiCuZn ferrites and different perovskite contents are investigated.After that,the influences of flux oxide Bi2O3,WO3,and Nb2O5 and the Ca2+,Ce4+ ions on this composite material are also studied.6.A LTCC band pass filter is designed with this composite material using the Ansoft HFSS software.This filter has insertion loss in the pass band 2.8 dB,the attenuation losses in the stopband were more than 30 dB,the centre frequency of the pass band is 1.4 GHz and the 3 dB band width is more than 160 MHz.

Progress in Research on Adjusting the Co-fireability of Different Materials for LTCC

Research on co-fireability of different materials using LTCC technology

Application and Research Progress of LTCC Materials

A Co-Fireable Material System for Ceramics and Ferrites Hetero-Laminates in LTCC Substrates

The Sintering Properties and Interfacial Investigation of Barium Ferrite and Ceramic Cofiring System for the Application of Ltcc Technology

The Co-Fired Behaviors Between Ag and Glass–ceramics Materials in LTCC

Research of LTCC/Cu, Ag Multilayer Substrate in Microelectronic Packaging

Thermal Sintering Matchability between LTCC Substrate and Silver Pastes and the Effect of CuO on Silver Diffusion Inhibition

Optimization of LTCC Multilayer Interconnect Substrate Process

Improvement of Gold Electrode Conductivity after Cofiring with CaO–B2O3–SiO2 Green Tapes for LTCC Application

Effects of Pb–B–Si–O Glass on the Microstructures and Electrical Properties of Silver Electrode for LTCC Application

Cofiring behavior of low-temperature sintering composite multilayer ceramic devices

Thermal Sintering Matchability Between Low‐Temperature Cofired Ceramic Substrate and Silver Pastes and the Effect of CuO on Silver Diffusion Inhibition

Current Research Status and Prospect of Multilayer Cofired Components Interfaces

Effects of Glass on Densification and Interfacial Bonding of LTCC Co-Fired Ag Electrode

Co-Firing Behavior of BaTiO3 and MgCuZn Ferrite Composite Materials

Research on Self-Constrained Sintering Low-Temperature Cofired Ceramic

Tuning high and low thermal expansion coefficients of Li2O–BaO–Al2O3–B2O3–SiO2/quartz LTCC composites by replacing quartz partly with α-Al2O3 or ZrO2

Study on Composite LTCC Materials

Effects of Additives and Heat Treatment on the Electrical Properties of Cobalt Interconnect Plating

Effect of interfacial stability on microstructure and properties of carbon fiber reinforced aluminum matrix composites