Abstract:Electroless nickel–phosphorus (Ni–P)-plated mold for hot press of optical lens must be manufactured to nanolevel surface roughness. The single-crystal diamond turning (SCDT) process is generally used to machine the Ni–P plating layer to attain the required form and ultrafine surface finish. However, this process frequently causes concentrically arranged tool marks to appear on the work surface. In this study, the Ni–P plating layer was polished with magnetic compound fluid (MCF) slurry to remove the tool marks. Two MCF slurries were used, one containing high-quality carbonyl iron particles (CIPs) and alumina (Al2O3) abrasive particles (1 µm), and the other containing CIPs coated with zirconia (ZrO2) abrasive particles (50–100 nm). First, spot polishing without relative motion between the center of the MCF carrier and the workpiece was carried out using both slurries. Then, scanning polishing with the MCF carrier moving along a motion path was carried out using only the MCF slurry containing ZrO2-coated CIPs. Although both slurries removed the SCDT-induced tool marks on the work surface, the MCF slurry containing relatively large Al2O3 abrasive particles left scratches and frequently caused CIPs to be embedded in the Ni–P plating surface, which inversely worsened the work surface roughness. In contrast, the MCF slurry containing relatively small ZrO2 abrasive particles resulted in an improved work surface roughness, without scratches or the embedding of particles. The cross-sectional profile of the polishing spot manifests a characteristic symmetrical W-shape. The dot-shaped scratches were induced at the spot center, and the lengths of these scratches increase with the increase in the distance from the spot center. In scanning polishing, the W-shaped polishing spot moves along the designed scanning path and instantaneous overlapping occurs, which significantly improves the flatness of the Ni–P plating layer from 0.2 to 0.1 µm. In addition, almost all the particles can move relative to the work surface, and the surface finish of the Ni–P plating layer was improved, without scratches or the embedding of particles. The preliminary results show that the MCF polishing is applicable to the nanolevel finishing of soft magnetic materials.

Investigation on Polishing of Zirconia Ceramics Using Magnetic Compound Fluid: Relationship Between Material Removal and Surface Roughness

Polishing Investigation on Zirconia Ceramics Using Magnetic Compound Fluid Slurry

Feasibility Study on the Precision Polishing of Zirconia Ceramics with Magnetic Compound Fluid (MCF) Slurry under the Assistance of Dielectrophoresis Effect

Ultrafine Polishing of Optical Polymer with Zirconia-Coated Carbonyl-Iron-particle-based Magnetic Compound Fluid Slurry

Preliminary Study of Disc Hydrodynamic Polishing

Investigation on Feasibility of Polishing Concave Surfaces Using Magnetic Compound Fluid Slurry.

Material removal characteristics of magnetic-field enhanced shear thickening polishing technology

Preparation of the Nanodiamond@SiO2 Abrasive and its Effect on the Polishing Performance of Zirconia Ceramics

Effect of the Components of Magnetic Compound Fluid (MCF) Slurry on Polishing Characteristics in Aspheric-Surface Finishing with the Doughnut-Shaped MCF Tool

Surface Planarization of Zirconia Ceramic Achieved by Polyacrylamide Grafted Nanodiamond Composite Abrasives Through Chemical Mechanical Polishing

Research on Chemical Mechanical Polishing Technology for Zirconium-Based Amorphous Alloys

Experimental Study on the Polishing of Aspheric Surfaces on an S-136 Mould Steel Using Magnetic Compound Fluid Slurries

Investigation on the Polishing of Aspheric Surfaces with a Doughnut-Shaped Magnetic Compound Fluid (MCF) Tool Using an Industrial Robot

Preparation of the rod-shaped SiO2@C abrasive and effects of its microstructure on the polishing of zirconia ceramics

Fundamental Investigation on the Polishing Aspheric Elements with Doughnut-Shaped MCF Slurry

A New Magnetic Compound Fluid Slurry And Its Performance In Magnetic Field-Assisted Polishing Of Oxygen-Free Copper

An experimental investigation of scan trajectory into the underwater femtosecond laser polishing SiC ceramic

Nano-precision Polishing of CVD SiC Using MCF (magnetic Compound Fluid) Slurry

Polishing of Zirconia Ceramics by Chemically-Induced Micro-Nano Bubbles

Optimization of polishing fluid composition for single crystal silicon carbide by ultrasonic assisted chemical-mechanical polishing

Ultrafine Polishing of Electroless Nickel–Phosphorus-Plated Mold with Magnetic Compound Fluid Slurry