Abstract:Process monitoring is one of the most crucial fundamental components in industrial processes. Traditional multivariate statistical analysis modeling only relies on data collected in normal condition, reflecting the lack of sensitivity to faults. This paper proposed a fault information-aided canonical variate analysis (FICVA) and a structured FICVA (SFICVA) monitoring strategy to improve fault detection rate. In FICVA, canonical variate analysis (CVA) is firstly applied to extract state and residual subspace based on normal data. Then, according to the data collected from one fault, the above subspaces are further decomposed into fault relevant and irrelevant state subspaces, and fault relevant and irrelevant residual subspaces for guaranteeing fault information can be concentrated. The correlation between normal data in various subspaces and the ability to concentrate abnormal information in fault data from fault relevant subspaces are theoretically analyzed. Then, to combine diverse fault information from different scenarios, SFICVA monitoring strategy is performed through Bayesian inference to ensemble a series of FICVA sub-models constructed by different faults to obtain more effective performance. Through a numerical example, experimental research on Tennessee Eastman process (TEP) and actual blast furnace ironmaking process (BFIP), rationality of FICVA method and effectiveness of SFICVA monitoring strategy are fully verified.

A Novel Process Variation Model for Test Cost Reduction in Wafers with Addressable Monitoring Structures

A Simulation Study for Analyzing an On-Demand Semiconductor Wafer Process

Just-In-Time Modeling with Variable Shrinkage Based on Gaussian Processes for Semiconductor Manufacturing

Structured Fault Information-Aided Canonical Variate Analysis Model for Dynamic Process Monitoring

Application of Gaussian Processes with Variable Shrinkage Method and Just-in-time Modeling in the Semiconductor Industry

Low-cost High-Accuracy Variation Characterization for Nanoscale IC Technologies Via Novel Learning-Based Techniques.

Monitoring Wafers' Geometric Quality Using an Additive Gaussian Process Model

Bayesian Model Fusion: Enabling Test Cost Reduction of Analog/rf Circuits Via Wafer-Level Spatial Variation Modeling.

Wafer-level Variation Modeling for Multi-site RF IC Testing via Hierarchical Gaussian Process

Design And Test Strategies For Microarchitectural Post-Fabrication Tuning

A Hierarchical Model For Characterising Spatial Wafer Variations

Extraction of Process Variation Parameters in FinFET Technology Based on Compact Modeling and Characterization

A novel approach to estimate the impact of analog circuit performance based on the small signal model under process variations

Semiconductor Manufacturing Process Monitoring Based on Adaptive Substatistical PCA

An improved method for test chip design

A Fully Automated Large-Scale Addressable Test Chip Design with High Reliability

Nanometer Interconnect Test Structure for Modeling of Process Variation

High-Throughput Addressable Test Structure Design for Nano-Scaled CMOS Device Characterization

Compact Modeling of Process Variations in Nanosheet Complementary FET (CFET) and Circuit Performance Predictions

ALAMO: an Improved Σ - Space Based Methodology for Modeling Process Parameter Variations in Analog Circuits

TCAD‐based statistical modeling methodology for nanoscale FinFET variability