Abstract:We developed a new platform that enables in-situ four-probe electronic measurements, in-situ three-probe field-effect measurements, nanomanipulation, and in-situ modification of nanodevices inside a transmission electron microscope (TEM). The platform includes a specially designed chip-holder and a silicon (Si) chip with suspended metal electrodes. The chip-holder can hold one Si chip with a size up to 3 mm x 3 mm and provides four electrical connections that can be connected to the micrometer-sized electrodes on the Si chip by wire-bonding. The other side of the electrical connections on the chip-holder is connected to the electronic instruments outside the TEM through a commercial Nanofactory SPM-TEM holder. The Si chip with suspended metal electrodes on one of its edges was fabricated by lithography and wet etching. Carbon nanotubes (CNTs), InAs nanowires, and tungsten disulfide nanowires were placed to stride over and connect to the suspended electrodes on the Si chip by nanomanipulations inside a scanning electron microscope (SEM). By using the platform, I-V curves of an individual single-walled CNT connecting to four electrodes were in-situ measured between any two of the four suspended electrodes, and a high-resolution TEM image of the same CNT was obtained. Furthermore, four-terminal I-V measurement on an InAs nanowire was achieved on this platform, and with a movable probe used as a gate electrode, field-effect measurement on the same InAs nanowire device was accomplished in SEM. In addition, by using the movable probe on the SPM-TEM holder, we could further in-situ modify nanomaterial and nanodevices. The present work demonstrates a method that allows a direct correlation between the atomic-level structure and the electronic property of nanomaterials or nanodevices whose structure can be further modified in-situ.

Distance from shading: vertical distances in the SEM obtained with a semi-transparent pinhole in the microprobe and processing of microprobe images

Vertical Distance from Shading in the SEM

Design and Fabrication of Microprobe for Vertical Measurement Using SEM

Nano-Displacement Measurement Based On Virtual Pinhole Confocal Method

Self-marked preparation of site-specific transmission electron microscope lamellae of nanodevices using focusing ion beam technique.

Performing Probe Experiments in the Sem

SEM Image-Based 3-D Nanomanipulation Information Extraction and Closed-Loop Probe Control

Novel 3D SEM Moiré method for micro height measurement.

A Simple Method Based on Vision for Obtaining Depth Information in Nanomanipulation

Thin Film Thickness Measurement Using Electron Probe Microanalyzer

A novel scanning tunneling microscopy for long range and high aspect ratio measurement

Nano-mapping of vertical contact electrodes using synchrotron scanning photoelectron microscopy

A Measurement Method for Micro 3D Shape Based on Grids-Processing and Stereovision Technology

Application of the digital phase-shifting method in 3D deformation measurement at micro-scale by SEM

Automatic 3D Reconstruction of SEM Images Based on Nano-robotic Manipulation and Epipolar Plane Images.

A platform for in-situ multi-probe electronic measurements and modification of nanodevices inside a transmission electron microscope.

Fiber Probe for Micro-Hole Measurement Based on Detection of Returning Light Energy

Wave Optical Modeling of the SEM Column From Source to Specimen

Ultraprecision Diameter Measurement of Small Holes with Large Depth-To-Diameter Ratios Based on Spherical Scattering Electrical-Field Probing

A Probe-Based Nanometric Morphology Measurement System Using Intermittent-Contact Mode