A Particle Debonding Model Considering Interface Nanoscale Damage Effect

Yu Liu,Jieshi Chen,Xianghuai Dong
DOI: https://doi.org/10.1088/1361-651x/abcba6
IF: 2.421
2020-01-01
Modelling and Simulation in Materials Science and Engineering
Abstract:The debonding of the inclusions or second phase particles from matrix which is controlled by energy and stress condition is an important source of voids nucleation in engineering materials. In this paper, firstly it is confirmed that energy condition for debonding can easily be satisfied for micron scale particles in plastic deformation by numerical simulation; then a stress controlled debonding model introducing the effect of nanoscale damage of the interface is proposed; then the parameters of the model are determined by fitting the published experimental data. Unlike traditional debonding models, the proposed model can reasonably predict the size effect that the debonding strain will increase with the decrease of particle size at micron scale, which was observed by experiments.
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