Abstract:This study addresses laser‐induced forward transfer (LIFT) limitations, such as shockwave generation and poor adhesion, using innovative methods. Laser surface texturing (LST) and low‐pressure environments (LPE) improve LIFT, enabling the deposition of additive layers. Energy analysis reveals that most absorbed energy transforms into internal energy with associated heat losses, as assessed through theoretical and finite element methods. Laser‐induced forward transfer is a contactless, nozzle free process which enables accurate, precise and fast development of 3D structures. However, a number of shortcomings such as shockwave generation, poor adhesion to receiver substrates and uniform depositions limit LIFT to be utilized. Therefore, this research tends to put forward easy and effective solutions for successful mitigation of the LIFT limitations. Receiver surface modifications and low‐pressure conditions are introduced through laser surface texturing (LST) and a vacuum pump. A number of textures and orientations are investigated for determining the optimal copper (Cu) deposition. Furthermore, utilization of the same laser system for LST enables the manufacturing process cost and time effective. In addition to Cu depositions, additive layers of silver (Ag) and platinum (Pt) are deposited. Finally, Ag and Pt micropillars are fabricated on their respective additive layers leading to formation of Cu‐Ag and Cu‐Pt alloys structure. Subsequently, electrical and material characterizations are made to validate for potential applications. Experimental evidence shows greater adhesion with electrical properties for LST‐based LIFT in low pressure conditions. Finally, an energy analysis is performed based on theoretical and finite element methods (FEM) to gain greater insights into mechanics of the LIFT process.

Laser Induced Forward Transfer of Brittle Cu3Sn Thin Film

Deformation-induced Interfacial Transition Zone in Cu/V Nanolamellar Multilayers

Laser-Induced Forward Transfer Technology and Its Numerical Simulation of Temperature Field

Innovative Fabrication of Metal Alloy Structures via Laser‐Induced Forward Transfer on Flexible Substrates

Laser induced reverse transfer of bulk Cu with a fs-pulsed UV laser for microelectronics applications

Experiment Study of Laser Thermal Enhanced Electrochemical Deposition

Laser-Driven Micro Transfer Placement of Prefabricated Microstructures

High Reflectivity and Thermal Conductivity Ag–Cu Multi-Material Structures Fabricated via Laser Powder Bed Fusion: Formation Mechanisms, Interfacial Characteristics, and Molten Pool Behavior

Research on Deforming Mechanism of Nanocrystalline Cu Thin Film under Contact Deformation

Modified Pulse Laser Deposition of Ag Nanostructure As Intermediate for Low Temperature Cu-Cu Bonding

Laser-induced thermo-compression bonding for Cu-Au heterogeneous nanojoining

Construction of Microstructures on the Cu Substrate Using Ultrafast Laser Processing to Enhance the Bonding Strength of Sintered Ag Nanoparticles

Femtosecond Laser-Induced Phase Transformations In Amorphous Cu77ni6sn10p7 Alloy

Thermal-stable Void-Free Interface Morphology and Bonding Mechanism of Low-Temperature Cu-Cu Bonding Using Ag Nanostructure As Intermediate

Ejection Regimes in Picosecond Laser-Induced Forward Transfer of Metals

Preparation of Cu-Cr-Zr Alloy by Laser Powder Bed Fusion: Parameter Optimization, Microstructure, Mechanical and Thermal Properties for Microelectronic Applications

Study on Cu6Sn5 Morphology and Grain Orientation Transition at the Interface of (111) Nt-Cu and Liquid Sn

The Surface Morphologies and Internal Pores Evolution of a CuSn10 Alloy Fabricated by Laser Powder Bed Fusion

Formation and growth mechanism of thin Cu 6 Sn 5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating

Cu-Cu Bonding By Ag Nanostructure At Low Temperature Of 180 Degrees C

Nanosecond Laser-Induced Surface Modification to Strengthen Cu/Si3N4 AMB Joints