Abstract:With the development of three-dimensional (3D) packaging technology, the dimension of solder joints is continuously shrinking. How to ensure the service performance of solder joints has become an important issue. As the solder joint height reduces to several microns, the total growth rate of Cu-Sn intermetallic compounds (IMCs) increases accordingly, meanwhile, whose proportion in solder joints will increase rapidly. At this point, the physics and mechanical characters of the solder joints won't depend primarily on the solder alloy, but on the IMCs. However, since the IMCs formed in solder joints have a non-cubic crystal structure, the IMC grains have a strong anisotropy along different crystal directions. Therefore, effective control of the orientation and growth behavior of IMC grains becomes a key issue in the 3D packaging fabricating. In the current study, the (001)Cu/Sn/Cu joints are fabricated by soldering under isothermy and temperature gradient (TG), respectively. Initially, the resultant η-Cu 6 Sn 5 grains show faceted prism textures with an intersecting angle of 90° on the (001)Cu end. However, in the isothermal soldering process, the initial faceted prism textures gradually disappear. By applying a TG, the IMCs on cold end, i.e. (001)Cu end, continue to grow rapidly and maintain the regular grain morphology. Moreover, the epitaxial growth direction of the IMCs is about parallel to the TG direction. These results provide a potential way to control the morphology and growth of Cu 6 Sn 5 grains in 3D packaging technology.

Growth Mechanism Of Interfacial Imcs On (111) Preferred Orientation Nanotwinned Cu Ubm For 3d Ic Packaging

Anomalous growth of interfacial intermetallic compounds on (111)-oriented nanotwinned Cu substrate

Mechanism on Preferred Orientation Roof-Type Cu6Sn5 Grain Formation in Micro-Bump with (111) Nanotwinned Copper UBM

Novel Growth Of Whole Preferred Orientation Intermetallic Compound Interconnects For 3d Ic Packaging

Role of (111) Nanotwinned Cu on Dissolution Behavior and Interfacial Reaction in Micro-Scale Nanotwinned Cu/Sn/Ni Interconnects

Growth Behavior of Cu6Sn5 Grains at Sn3.0Ag/(001)Cu Soldering Interface

Growth Behavior and Orientation Evolution of Cu6Sn5 Grains in Micro Interconnect During Isothermal Reflow

Obstructed Growth of Interfacial Intermetallic Compounds on (011) and (111)-Oriented Nanotwinned Cu Substrates

Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient

Study on Cu6Sn5 Morphology and Grain Orientation Transition at the Interface of (111) Nt-Cu and Liquid Sn

Growth Behavior of Cu<inf>6</inf>Sn<inf>5</inf> Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient

Effects of Electromigration on Microstructural Evolution and Mechanical Properties of Preferential Growth Intermetallic Compound Interconnects for 3D Packaging

Thermal and Compositional Fields to Maneuver Cu 6 Sn 5 Intermetallic Growth on (111) Nanotwinned Copper Substrate

Growth Behavior of IMCs on <001>-Oriented and Large-grain Electroplated Cu Substrate

Quasi In-Situ Study Of Morphological Evolution Of The Interfacial Imc In Single-Sided Interface Sn-0.3ag-0.7cu/Cu Joints During Multiple Reflow Process

The Effect of Pressure and Orientation on Cu-Cu3Sn Interface Reliability under Isothermal Ageing and Monotonic Traction Via Molecular Dynamics Investigation

A Molecular Dynamics Investigation of the Effect of Pressure and Orientation on the Cu Consumption in Cu-Cu3Sn Interface under Isothermal Ageing and Its Dissipative Mechanisms during Traction

Growth behavior and morphology evolution of interfacial (Cu,Ni)6Sn5 in (001)Cu/Sn/Ni micro solder joints

Formation of preferred orientation of Cu 6 Sn 5 grains in Cu/Sn/Cu interconnects by soldering under temperature gradient

Analysis and Control of Cu6Sn5 Preferred Nucleation on Single Crystal (0 0 1)Cu

Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films