Abstract:Two key technologies in electronics industry are chip technology and packaging technology. Solder plays a crucial role in the assembly and interconnection in the electronic packaging industry. As a joint material, solder provides electronic, thermal and mechanical continuity. The eutectic Sn-Pb alloy has been widely used in surface mount technology (SMT) for the interconnection and mechanical support between electronic components and printed circuit boards (PCB). During the last decades, there have been strong worldwide environmental movements towards "green" non-toxic electronic products. Initiatives and legislation forced the electronics industry to replace lead containing products with more environmental friendly, lead free products. Sn-Zn solder system is therefore a promising candidate, recommended for its low melting temperature, around 200°C, which is close to the melting temperature of the traditional binary tin lead solder. But the low cycle fatigue data of Sn-Zn solder system has not been reported yet and the lack of reliability data is one of the barriers to the application of the Sn-Zn system solder alloy. The aim of the present work is to investigate the low cycle fatigue behaviour of the lead-free Sn-8Zn-3Bi solder joint using lap shear test samples. Finite element simulation is presented and the Coffin-Mason equation for Sn-8Zn-3Bi solder joint is given based on the experimental and simulation results: Nf = 0.0294 ()-2.833 Where the Nf is the number of cycles to failure and  is the plastic shear strain. Another important issue, related to reliability of solder joints that has been investigated in this work, is the intermetallic compounds (IMCs). Generally, the interconnection by the solder joint is completed by the formation of IMCs at the interface and the reliability of the whole package is affected by IMCs due to their inherent brittle nature and tendency to generate structural defects. The interfacial reaction of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on Au/electroless Ni metallization after high temperature storage (HTS) testing at 150°C is investigated for the reliability of electronic production from the metallurgical viewpoint in this work. It is noticed that Ni3Sn4 intermetallic compounds (IMCs) are found in the Sn-Ag system, while two kind of interfacial productions that are (Ni,Cu)3Sn4 IMC layer and (Cu,Ni)6Sn5 spalling compound gains exists in the Sn-Ag-Cu system. Kirkendall voids are found in both lead free solder joints and clear gap exists at the interface for the case of Sn-Ag solder joint after 1000 hour aging.

Characterization of Mechanical Performance of Sn/Ag/Cu Solder Joints with Different Component Lead Coatings

Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test

Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

Wetting Behaviors and Interfacial Reaction Between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

Effect of Indium, Bismuth and Copper Doping on Microstructure and Mechanical Properties of Sn5Sb and Sn3.5Ag Lead Free Solder Alloys

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Low Cycle Fatigue Reliability and Interfacial Reaction of Lead-free Solder Joints for Electronic Packaging

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints

Mechanical Properties and Evolution Behaviors of Different Sn63Pb37 Solders Under Reliability Test

Effect of Refl owing Atmosphere on Mechanical Properties of Sn-3.0Ag-0.5Cu Pb-free Solder Joints

Effect of Co on the Morphology and Mechanical Properties of the Sn-3.0Ag-0.5Cu/Sn-58Bi Composite Solder Joints on ENEPIG Surface

Study of New Types Lead-Free Solder Alloys of Sn-Ag-Cu-Al-Ni and Sn-Zn-Bi-In-P

Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam

Influence of Thermal Cycling on the Microstructure and Shear Strength of Sn3.5ag0.75cu and Sn63pb37 Solder Joints on Au/Ni Metallization

Finite Element Analysis of SnAgCu(Zn, Co, Fe) Lead-free Solder Joints for Electronic Packaging

Study on Mechanical Property and Solder ability of SnAgCu System Lead-free Solder Alloy

Microstructure and Properties of AgCu/2 Wt% Ag-added Sn–Pb Solder/cube Joints Fabricated by Vapor Phase Soldering

Effect of Nano-Cu6Sn5 Upon Development Mechanism of Cu–Ni–Sn Compounds and Mechanical Characteristics for Mixed Solder Joints

Impact of Tensile Strength on Thermal Fatigue Properties and Failure Modes of Sn-Ag-Cu-Ni Solder Joints