Abstract:An innovational self-reduction molecular-level-mixing method was proposed as a simplified manufacturing technique for the production of carbon nanotube copper matrix composites (CNT/Cu). Copper matrix composites reinforced with varying amounts of (0.1, 0.3, 0.5 and 0.7 wt%) carbon nanotubes were fabricated by using this method combined with hot-pressing sintering technology. The surface structure and elemental distribution during the preparation of CNT/Cu mixing powder were investigated. The microstructure and comprehensive properties of the CNT/Cu composites were examined by metallography, mechanical and electrical conductivity tests. The results revealed that the CNT/Cu could be produced by a high temperature reaction at 900 degrees under vacuum, during which the carbon atoms in the carbon nanotubes reduced the divalent copper on the surface to zero-valent copper monomers. The decrease in the ratio of D and G peaks on the Raman spectra indicated that the defective spots on the carbon nanotubes were wrapped and covered by the copper atoms after a self-reduction reaction. The prepared CNT/Cu powders were uniformly embedded in the grain boundaries of the copper matrix materials and effectively hindered the tensile fracture. The overall characteristics of the CNT/Cu composites steadily increased with increasing CNT until the maximum at 0.7 wt%. The performance was achieved with a hardness of 86.1 HV, an electrical conductivity of 81.8% IACS, and tensile strength of 227.5 MPa.

Fabrication of CNT/Cu Based Composite with Twice In-Situ Formation from Powder Preparation to Sintering

Microstructure and Properties of In-Situ TiC Reinforced Copper Nanocomposites Fabricated Via Long-Term Ball Milling and Hot Pressing

CNTs/Cu-Ti Composites Fabrication Through the Synergistic Reinforcement of CNTs and in Situ Generated Nano-Tic Particles

Fabrication of CNT/Cu Composites with Enhanced Strength and Ductility by SP Combined with Optimized SPS Method

Optimization of the mechanical properties of CNTs/Cu composite by regulating the size of interfacial TiC

Fabrication of Copper Matrix Composites Reinforced with Carbon Nanotubes Using an Innovational Self-Reduction Molecular-Level-Mixing Method

Simultaneous achievement of high strength, excellent ductility, and good electrical conductivity in carbon nanotube/copper composites

Well-dispersion of CNTs and Enhanced Mechanical Properties in CNTs/Cu-Ti Composites Fabricated by Molecular Level Mixing

Microstructures and Tensile Behavior of Carbon Nanotubes Reinforced Cu Matrix Composites with Molecular-Level Dispersion

In-situ Fabrication of Nano-Sized TiO2 Reinforced Cu Matrix Composites with Well-Balanced Mechanical Properties and Electrical Conductivity

Fabrication of CNTs/Cu ultrafine powders and composite materials

Preparation, Mechanical Properties and Electrical Conductivity of Carbon Nanotube Reinforced Cu Matrix Composites

Fabrication, Mechanical Properties and Electrical Conductivity of Al2O3 Reinforced Cu/CNTs Composites

Improvement of interfacial interaction and mechanical properties in copper matrix composites reinforced with copper coated carbon nanotubes

Novel Synthesizing and Characterization of Copper Matrix Composites Reinforced with Carbon Nanotubes

Regulating the mechanical properties and electrical conductivity of CNTs/Cu composites by tailoring nano-sized TiC on the surface of intact CNTs

Enhancing the Strength of Carbon Nanotubes Reinforced Copper Matrix Composites by Optimizing the Interface Structure and Dispersion Uniformity

Fabrication and Densification of High Performance Carbon Nanotube/copper Composite Fibers

Fabrication of Carbon Nanotubes/cu Composites with Orthotropic Mechanical and Tribological Properties

Preparation of CNTs/Cu Composites with Good Electrical Conductivity and Excellent Mechanical Properties

Optimizing the interface bonding in Cu matrix composites by using functionalized carbon nanotubes and cold rolling