Effect of Deposition Potential on Structure and Magnetic Properties of Electrodeposited FeCoCu Thin Films
Shreesh Kumar Shrivastava,Manvendra Singh Khatri,Shivani Agarwal
DOI: https://doi.org/10.1007/s11664-024-11561-4
IF: 2.1
2024-11-06
Journal of Electronic Materials
Abstract:FeCoCu alloy films has been electrodeposited on gold (Au)-coated silicon substrates on three electrodes set up at varying deposition potential − 1.0 V, − 1.2 V, and − 1.5 V. Cyclic voltammetry (CV) measurement confirms that there is no peak during the co-deposition of Fe, Co, and Cu. Nevertheless, for the corresponding element, the dissolution occurred with absolute anodic peaks. With an increase of deposition potential, the morphology of the grains of the films changes from round shape to nodal shape, while the size of the grains has also been changed. Energy-dispersive x-ray spectroscopy (EDS) measurements confirm the change in the composition of all three elements in the films, as the deposition potential changes from − 1.0 to − 1.5 V, the film composition becomes Fe 19 Co 71 Cu 10 , Fe 40 Co 45 Cu 15 , and Fe 57 Co 33 Cu 10 , respectively. X-ray diffraction (XRD) patterns showed that the crystal structure of electrodeposited FeCoCu films have a mixture of body-centered cubic (bcc) and face-centered cubic structure (fcc). A vibrating sample magnetometer was used for magnetic measurements. The saturation magnetization and coercivity ( Hc ) increases as the deposition potential increases. The easy axis of the films lies parallel to the film plane and shows anisotropic behavior. The variation in the magnetic properties of the FeCoCu films were attributed to the change in the elemental composition of the films caused by the deposition potential.
engineering, electrical & electronic,materials science, multidisciplinary,physics, applied