Modified Failure Mechanism of Silicon Through Excess Electrons and Holes

Shen Yidi,An Qi
DOI: https://doi.org/10.1007/s11837-020-04180-x
2020-01-01
JOM
Abstract:Electron and hole carriers are ubiquitous in quantum devices, while their effects on the mechanical properties of devices remain unclear. Here we use silicon (Si) as the prototype material and employ density functional theory to illustrate how electrons and holes influence its deformation and failure mechanism. First, we found that electrons and holes weaken the bonds in single-crystal Si, reducing the intrinsic yield strength. Then, the nanotwinned Si was deformed under ideal shear deformation to illustrate the interaction between carriers and microstructures. At neutral state, the nanotwinned Si experiences a structure recovery during shear deformation, whereas the bonds along twin boundaries (TBs) break with both excess electrons and holes. This arises from the injected carriers that are attracted by TBs, weakening the electrostatic interactions between bonded Si atoms near TBs. Our findings provide important information on the modified mechanical properties of Si with both excess electrons and holes.
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