Temperature-Aware Scheduling Based on Dynamic Time-Slice Scaling

Gangyong Jia,Youwei Yuan,Jian Wan,Congfeng Jiang,Xi Li,Dong Dai
2014-01-01
Abstract:As power density increases with high technology, the high temperature has threatened the system performance, reliability and even system safety. In this paper, we propose a temperature-aware task scheduling approach which combines low-overhead Time-Slice Scaling (TSS) with Alternative Scheduling schemes to reduce temperature. Through fine-grained thermal characterization based on task behavior, dynamically determine Time-slice Scaling factor (TSF) for each task on real-time. Besides, combining alternative scheduling scheme based on boosting thermal model. Experimental results demonstrate our proposed policy can reduce the chip average and peak temperature maximums by 3.1 degrees C and 2 degrees C with negligible performance loss.
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