Preparation and Properties of Hollow Ceramic Spheres-Epoxy Dielectric Composites

Fan Jiang,Zhihui Li,Xin Ji,Gao Chen,Chunming Niu
DOI: https://doi.org/10.1109/tdei.2020.008711
IF: 2.509
2020-01-01
IEEE Transactions on Dielectrics and Electrical Insulation
Abstract:High strength hollow ceramic spheres are incorporated into epoxy resin to prepare insulating composite materials. The characterization shows simultaneous enhancement in thermal conductivity, mechanical strength and dielectric permittivity. A thermal conductivity of 1.36 W/(m·K) (7.5 times of that of pure epoxy) is measured from the sample prepared from hollow spheres with high alumina content. The compressive strength and impact strength measured from the same sample are 104.04 MPa and 3.61 kJ/m2, corresponding to an increase of 18.3 and 31.4 %, respectively, from pure epoxy. The permittivity of the sample measured at low frequency is 9.85 which decreases slightly as frequency increased to 106 Hz. The electrical breakdown data are analyzed with Weibull model and the decreased breakdown strength is explained.
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