Abstract:2D materials with high thermal conductivity are reviewed. From microelectronics, the guiding role of theory for engineering and application is summarized. The specific ideas throughout different thermal management applications are categorized. The prospects and challenges are tackled, and an objective view about future opportunities to build 2D‐based heat dissipating system is also expressed. Transistors are getting close to their physical limitation, and complex chip design technologies have made the hotspot problem more serious. Graphene and hBN, as representative 2D semi‐metal and dielectric materials, possess excellent thermal conductivities. Intrinsic 2D materials, 2D film materials, and 2D composite materials have been investigated, showing great potential for next‐generation thermal‐management materials. There are products that have already been commercialized based on graphene and hBN, but many companies seem to be sitting on the fence, and the obstacles toward implementation of these materials need to be specified. Here, high thermal conductivity 2D materials from theory and engineering to applications are reviewed, aiming to provide a comprehensive summary of the current state of the art of this field in order to give an overview and future prospects in application, manufacturing, and commercialization. From the theoretical perspective, the impact factors and development path of 2D materials for thermal dissipation and the engineering aspect of structural design are presented. The prospects and challenges are also tackled, expressing an objective view about future opportunities to build 2D‐based heat‐dissipation systems.

Thermal conductivity decomposition in two-dimensional materials

Thermal Conductivity Decomposition in Two-Dimensional Materials: Application to Graphene

Spectral Decomposition of Thermal Conductivity: Comparing Velocity Decomposition Methods in Homogeneous Molecular Dynamics Simulations

Interpretation of Apparent Thermal Conductivity in Finite Systems from Equilibrium Molecular Dynamics Simulations

Thermal conductivity prediction by atomistic simulation methods: Recent advances and detailed comparison

Accelerated molecular dynamics force evaluation on graphics processing units for thermal conductivity calculations.

High Thermal Conductivity 2D Materials: from Theory and Engineering to Applications (adv. Mater. Interfaces 21/2022)

Methods for Measuring Thermal Conductivity of Two-Dimensional Materials: A Review

Investigating mechanical properties and thermal conductivity of 2D carbon-based materials by computational experiments

Characterization of Thermal Transport in One-Dimensional Solid Materials

Homogeneous nonequilibrium molecular dynamics method for heat transport and spectral decomposition with many-body potentials

High Thermal Conductivity 2D Materials: From Theory and Engineering to Applications

Site-projected Thermal Conductivity: Application to defects, interfaces, and homogeneously disordered materials

The Reconstruction of the Space-Dependent Thermal Conductivity from Sparse Temperature Measurements

Optomechanical methodology for characterizing the thermal properties of 2D materials

Transformation Thermotics for Thermal Conduction and Convection

Reconstruction of Thermal Properties of Inhomogeneous Materials from One Dimension to Two Dimensions

A Generalized 3ω Method for Extraction of Thermal Conductivity in Thin Films

Photothermal-Transport Imaging and Thermal Management of 2D Materials

Simultaneous measurement of anisotropic thermal conductivity and thermal boundary conductance of 2-dimensional materials