High Thermal Conductivity 2D Materials: from Theory and Engineering to Applications (adv. Mater. Interfaces 21/2022)

Fan Wu,He Tian,Yang Shen,Zheng‐Qiang Zhu,Yanming Liu,Thomas Hirtz,Rui Wu,Guangyang Gou,Yancong Qiao,Yi Yang,Chao‐Yang Xing,Gang Zhang,Tian‐Ling Ren
DOI: https://doi.org/10.1002/admi.202270116
IF: 5.4
2022-01-01
Advanced Materials Interfaces
Abstract:High Thermal Conductivity 2D Materials In article number 2200409, Fan Wu, He Tian, Chao-yang Xing, Gang Zhang, Tian-Ling Ren, and co-workers discuss high thermal conductivity 2D materials from theory and engineering to applications, especially on graphene and hexagonal boron nitride. The impact factors and development path of 2D materials for thermal dissipation and the engineering aspect of structural design are presented. Moreover, the future opportunities to build 2D-based heat-dissipation systems are discussed.
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