Atomistic simulation of metal-polymer adhesion

J. Y. Wu,S. Nagao,J. Y. He,Z. L. Zhang

2011-01-01

Abstract:The micron-size monodisperse polymer particles have received great industrial and scientific attentions over the past two decades due to a wide variety of applications such as toners, instrument calibration standards, column packing materials for chromatography, biomedical and biochemical analyses. A new area which utilizes metal-coated conductive polymer particles for anisotropic conductive adhesives applications in liquid crystal display and microsystems has recently emerged. The metalized polymer particles have the potential to shrink the package size, reduce manufacturing cost, and be lead-free. However, a critical issue of the metal-coated polymer particles concerns the adhesion between metal and polymer, which strongly affects the resulting mechanical and thermal properties. The adhesion strength, in turn, depends mostly on the interface chemistry and interface atomic-scale morphology. The strength and reliability of metal-polymer joints are mainly the result of the play of forces of intermolecular interaction between metal and polymer. The interaction between these condensed bodies at distances on the nano-size refers to a very complicated set of inter-connected phenomena that is far from being understood. Therefore, the present work uses atomistic simulation to study the tensile and shear strength of a Nickel s-PMMA interface at the molecular level.