Ammonia oxidation by in-situ chloride electrolysis in etching wastewater of semiconductor manufacturing using RuSnO x /Ti electrode: Effect of plating mode and metal ratio

Seto Sugianto Prabowo Rahardjo,Yu-Jen Shih,Chen-Shiuan Fan
DOI: https://doi.org/10.1016/j.jhazmat.2024.134042
IF: 13.6
2024-03-23
Journal of Hazardous Materials
Abstract:The indirect chloride-mediated ammonia oxidation encounters challenges in maintaining the effectiveness of metal oxide anodes when treating wastewaters with complex compositions. This study aims to develop a highly stable anode with RuO 2 -SnO 2 coatings for treating an etching effluent from semiconductor manufacturing, which majorly contains NH 3 and organic compounds. The RuSnO x /Ti electrode was synthesized using wet impregnation and calcination processes. The metal oxide configuration on Ti plate substrate was tuned by varying the step-dipping process in RuCl 3 and SnCl 4 baths. A 10-day continuous-flow electrolysis was conducted for studying the ammonia removal and chlorine yield under variable conditions, including detention, pH, current density, and initial ammonia and chloride concentrations. In the RuSnO x coatings, the configuration comprising RuO 2 nanorods as the surface layer and an intermediate layer of SnO 2 crystallites (by plating Ru 3+ for three times to cover one Sn 4+ layer, denoted as the Ru 3 Sn/Ti electrode) exhibited the best durability for acid washing, along with relatively high Faradaic efficiency and low energy consumption. To further improve the treatability of real wastewater (NH 3 -N = 634 mg L −1 , chemical oxygen demand (COD) = 6700 mg L −1 , Cl - = 2000 mg L −1 , pH 11), the duel-cell electrolyzers were constructed in series under a current density of 30 mA cm −2 and 45 min detention. Ultimately, removals of NH 3 and COD reached 95.8% and 76.3%, respectively, with successful limitation of chloramine formation.
environmental sciences,engineering, environmental
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