Special Issue on InterPACK 2018

Ercan M Dede,Lauren Boteler,Changqing Chen,Przemyslaw Jakub Gromala,Benjamin Leever,Wei Li
DOI: https://doi.org/10.1115/1.4043484
2019-01-01
Journal of Electronic Packaging
Abstract:With nearly 185 technical papers and presentations, InterPACK 2018 reflected the changing landscape of electronics and photonics packaging as it pertains to the internet of things and efficient power delivery. Accordingly, the conference consisted of five technical tracks including:(1) heterogeneous integration: microsystems with diverse functionality,(2) servers of the future, internet of things, and edge to cloud,(3) structural and physical health monitoring,(4) power electronics, energy conversion, and storage, and (5) autonomous, hybrid, and electric vehicles.This Special Issue of the ASME Journal of Electronic Packaging (JEP) was compiled based on recommendations from the peer review of the conference papers and from manuscripts submitted by authors of technical papers and presentations from the postconference open solicitation. All submitted manuscripts were subject to an independent peer-review …
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