Special Issue on Hot Interconnects 30

Scott Levy,Whit Schonbein
DOI: https://doi.org/10.1109/mm.2024.3373338
IF: 2.8212
2024-04-09
IEEE Micro
Abstract:The IEEE Hot Interconnects Symposium celebrated its 30th year in 2023 with an exceptional series of presentations from industry and academia on the design, implementation, and effective use of high-performance interconnects. A core role of the Symposium is to promote the dissemination of cutting-edge research in the field. To this end, the 2023 Symposium included eight peer-reviewed presentations. This special issue of IEEE Micro presents revised and expanded versions of five of the best of these contributions.
computer science, software engineering, hardware & architecture
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