Property Study of Sn-Zn-Bi-In-P Lead-Free Solder

WANG Zhenghong,YU Hongjiao,LI Shengming,MA Jusheng,ZHANG Gong

DOI: https://doi.org/10.14106/j.cnki.1001-2028.2014.11.023

2014-01-01

Abstract:Due to the excellent oxidation resistance and corrosion resistance, which make up for the wet ability deficiency of Sn-Zn solder, new lead-free solder Sn-4.5Zn-2Bi-In-P and Sn-9Zn-2.5Bi-In-P have great practicability. The physical properties:density, melting point, linear expansion coefficient, resistivity and wetting angle on copper substrates of all four solders:Sn-9Zn, two new Sn-Zn lead-free solders and Sn-37Pb were measured. Experiments show that, the density of new Sn-Zn lead-free solder is 3/4 of the density of Sn-37Pb; melting point(194℃, 191.9℃, respectively) is close to Sn-37Pb, and melting range is only 8℃; during 25-100℃, the linear expansion coefficients of Sn-4.5Zn-2Bi-In-P and Sn-9Zn-2.5Bi-In-P are 20.8×10-6/℃,16.9×10-6/℃, respectively, better than Sn-37Pb(21.2×10-6/℃); Resistivities of Sn-4.5Zn-2Bi-In-P and Sn-9Zn-2.5Bi-In-P are 1.73×10-6 Ω·m, 1.79×10-6 Ω·m, respectively, better than Sn-37Pb (1.96×10-6Ω·m);wetting angle on Cu substrate of two new Sn-Zn lead-free solder is about 30°,which meets the minimum requirements of practicability.