Experimental and Finite Element Analysis of Frictional Heat Distribution during Sliding Friction

KeunChey SUNG,Pengyi TIAN,Yu TIAN
DOI: https://doi.org/10.3969/j.issn.0254-0150.2017.03.005
2017-01-01
Abstract:The temperature rising caused by frictional heat plays a significant role in the material stability of the moving parts.Despite the extensive theoretical analysis of the previous studies on frictional heat distribution,there is not enough experimental confirmation to test these theories.Since the complex interactions between the sliding bodies during an actual sliding,the actual heat distribution may differ from the theoretical predictions.The interface and bulk temperature rising of a pin-on-plate friction pairs during sliding friction experiment were measured using the dynamic thermocouple method and infrared spectroscopy,and the measured data were compared to the corresponding finite element model.The finite element analysis shows that when the thermal conductivity of the stationary body is greater than that of the moving body,the frictional heat distribution may display time-dependent characteristics.The comparison between the experiment and finite element model results show that the surface films formed as a result of adhesive wear can have a complex impact on the frictional heat distribution:When the thermal conductivity of the stationary body is higher than that of the moving body,the surface film tends to decrease the amount of frictional heat flowing into the stationary body,and vice versa.
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