The Effect of Hot Isostatic Pressing on Thermal Conductivity of Additively Manufactured Pure Tungsten

Jinhan Chen,Kailun Li,Yafei Wang,Leilei Xing,Chenfan Yu,Hailong Liu,Jing Ma,Wei Liu,Zhijian Shen
DOI: https://doi.org/10.1016/j.ijrmhm.2019.105135
2020-01-01
Abstract:The crack-healing behaviors and microstructure evolution of pure tungsten produced by laser powder bed fusion (LPBF) were studied and compared before and after post hot isostatic pressing (post-HIP) treatment. An average thermal conductivity of 133 W.m(-1).K-1 at room temperature (RT) was obtained after HIP, which was 16% higher than that of as-built sample (115 W.m(-1).K-1). Although the HIP process had little effect on density, it resulted in a large grain size of > 300 mu m accompanied by a decrease in dislocation density and crack healing, which led to a substantial improvement of thermal conductivity of pure tungsten. The positive correlation between relative density and thermal conductivity of as-built tungsten was reported.
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