Flexible Ternary Resistive Memory from Organic Bulk Heterojunction

Yong-Yon Zhao,Wuji Sun,Min-Gong Wang,Jing-Hui He,Jian-Mei Lu
DOI: https://doi.org/10.1002/admt.201900681
IF: 6.8
2019-01-01
Advanced Materials Technologies
Abstract:Organic ternary resistive memory suffers from low device yield and wide writing voltage distribution and improvement through laborious molecular formula innovation is limited. Here, organic bulk heterojunction is employed as the active material in resistive random-access memories (RRAMs). The ternary memory yield of the device reaches 58% when prepared by blending X55 (N2, 7-bis(4-methoxyphenyl)N2, N7-bis (2-spiro [fluorene-9,9 '-oxanthracene]-spiro[fluorene-9,9 '-oxanthracene]-2,7-diamine) and PCBM (1-(3-methoxycarbonyl)propyl-1-phenyl[6,6]C61) with a 1:1 molar ratio, which is the highest yield among all prepared devices including pure X55, PCBM, or layer-by-layer stacking of X55 and PCBM. Furthermore, the mixture could be made on a flexible substrate and has sufficient toughness to sustain its memory performance after 5000 bending cycles or a bending angle of 62 degrees. This work provokes new thinking about future material design and selection with donor-acceptor bulk heterojunction use in potential wearable RRAM devices.
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