High-Yield Triple-Stack Bonding Fabrication Process for Micromachined Micromotors with Contactless Rotor

Boqian Sun,Shunyue Wang,Yidong Tan,Fengtian Han
DOI: https://doi.org/10.1109/transducers.2019.8808462
2019-01-01
Abstract:Anodic bonding process is widely used in fabrication of micromachined devices. In order to improve the yield and quality of micromachined devices with movable structures, this paper demonstrates a glass-silicon-glass triple-stack anodic bonding strategy by applying multi-step low-bonding voltages. An optimized bonding parameter was analyzed and implemented on a micromachined electrostatic micromotor with a contactless ring-shaped rotor. Experimental results indicate a significant improvement on the yield of the free-rotor micromotor benefiting from such improved bonding process.
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